The demand for power electronics applications has grown disproportionately due to megatrends such as renewable energies and electromobility.
If you want to manufacture the power systems needed for these applications, they need base plates or printed circuit boards with high temperature stability and excellent electrical conductivity. This can be achieved with an adhesive layer on ceramic, which serves as a basis for lamination with copper foil, for example.
Another application is the deposition of thick dielectric barrier layers based on oxynitride, which ensure excellent electrical decoupling.
We offer you modular coating systems for the production of these components.
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