Magnetron Sputtering
Key Technology from In-house Development & Manufacturing

One of our most important core technologies is magnetron sputtering. In this process, the coating material is removed from a solid target and transferred to the substrate.

This is done in a magnetic field-enhanced gas discharge in a vacuum. This discharge creates a plasma, a mix of electrons and positive gas ions. The positively charged ions are accelerated by an electric field onto the surface of the target, which is connected as a cathode. This knocks individual atoms out of the target surface.

These atoms condense on a substrate, for example glass, and form the functional layer. The substrate is either continuously moved past the magnetron sputter source (dynamic coating) or exposed to the vapor flow for a defined time (static coating). In dynamic coating, the thickness of the layer is determined by the rate of material removal from the target and the speed at which the substrate passes. In static coating, the dwell time determines the thickness.

Magnetron sputtering can be used for a variety of metallic and ceramic coating materials. Depending on the process, complex coatings with a thickness of up to several hundred nanometers can be deposited very efficiently and with high uniformity on large areas. Depending on the application, tubular or planar targets are used, the length of which can be scaled with the width of the substrates to be coated.

Magnetrons are key components at VON ARDENNE.  We develop and manufacture the magnetrons in-house. This allows us to incorporate the extensive knowledge we have gained from hundreds of delivered systems and components.

Would you like to learn more? Then click on the content below or contact us directly.


Very extensive process know-how

for a wide range of sputtering applications

Deposition of complex layer systems

of high homogeneity on small and large areas

Wide portfolio of different magnetron types

from in-house development & manufacturing

Magnetron Sputtering: How It Began and How VON ARDENNE Became a Technology Pioneer

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Magnetron Sputtering: How Microelectronics Became the Driving Force in its Development

In an earlier article, you have learned how the sputtering technology began. After this technology had been physically and technically implemented by…

How Proven Plasma Components Help Reduce Costs & Improve Quality

A Chinese proverb says "一根筷子容易折, 一把筷子难折断’", meaning ‘one chopstick can be easily broken while a bundle of chopsticks cannot’. If you apply this…

The Development of Process Control Systems for Sputtering

The process control of sputter processes has a long history and many sensors and approaches have been studied and employed. But how has it been…

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Ronny Borchel

Product Manager Plasma Components VON ARDENNE GmbH

Sales Team

Am Hahnweg 8
01328 Dresden