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MEMS - Targeted deposition & combination for MEMS:

Targeted deposition & combination for MEMS: with customized equipment Metallic, Non-Metallic, Optical & Semiconducting Layers

MEMS - Cost-efficient equipment

Cost-efficient equipment due to fully automated concept

MEMS - Easy adaptation to new processes & requirements

Easy adaptation to new processes & requirements due to flexibly configurable equipment

Piezoelectric Sensors & Actuators - Floor space is saved

Floor space is saved due to compact design

Advanced Panel-Level Packaging - Coating complex three-dimensional structures

Coating complex three-dimensional structures with specially adapted panel coating systems metallization with good adhesion

Advanced Panel-Level Packaging - Cost-efficient equipment

Cost-efficient equipment due to fully automated concept

Advanced Panel-Level Packaging - Easy adaptation to new processes & requirements

Easy adaptation to new processes & requirements due to flexibly configurable equipment

Advanced Panel-Level Packaging - Highly productive system platform

Highly productive system platform based on extensive process know-how

Printed Circuit Boards - Cost-efficient equipment

Cost-efficient equipment due to fully automated concept

Power Electronics - Cost-efficient equipment

Cost-efficient equipment due to fully automated concept