Semiconductors
Vacuum Deposition Equipment & Solutions

The world of semi­con­duc­tors is al­ways evol­ving. Meet­ing em­er­ging re­quire­ments de­mands cus­tom­er-oriented, flex­i­ble and new so­lu­tions.

As a de­po­si­tion so­lu­tions spe­cial­ist, VON AR­DENNE of­fers com­pre­hen­sive ser­vices to sup­port our cus­tom­ers. Our high-pre­ci­sion en­gi­neer­ing and ma­te­ri­als sci­ence ex­pert­ise en­ables cus­tom de­sign, en­gi­neer­ing, man­u­fac­tur­ing, com­mis­sion­ing and ser­vice for de­po­si­tion e­quip­ment and com­po­nents.

Our strong le­ga­cy in vac­uum tech­nol­o­gy and de­po­si­tion so­lu­tions, as well as ma­te­ri­als and op­tics tech­nol­o­gies, means we ex­cel in de­vel­op­ing lead­ing-edge semi­con­duc­tor pro­cess­es and e­quip­ment to meet each cus­tom­er’s u­nique re­quire­ments.

Would you like to learn more? Explore the content below or contact us.

Configuration of custom solutions to meet emerging requirements

by highly experienced teams

Configure-to-order flexibility

in platform & component development for advanced technologies

Long-term, highly collaborative partnerships

support customers from project start to finish

FAQ

High-precision vacuum deposition equipment, custom engineering, manufacturing, commissioning, and lifecycle service for wafer and panel applications. 

Magnetron sputtering, electron-beam evaporation, thermal evaporation, laser-arc evaporation, and related pretreatment and in-process measurement systems. 

Yes. We tailor platforms and components to specific materials, throughput, and line-integration needs, using a configure-to-order model to accelerate time to value. 

Advanced packaging, MEMS, and PiezoMEMS today, with broader coverage across front-end and back-end semiconductor use cases.

CLEANROOM
  • Manufacturing of vacuum coating systems
  • Sampling & pilot deposition services
  • 600 m² semiconductor cleanroom including AMC capability
Support
Media
VON ARDENNE Addresses Semiconductor Panel-Level Packaging Market with New HiPIMS Deposition Solution

HiPIMS deposition enables dense, highly adherent films for panel-level packaging applications

Beyond Silicon Carbide & Gallium Nitride —on Gallium Oxide & the Case for PVD

Aalyia Shaukat of Power Electronics News interviews Guido Überreiter, VP of Semiconductor Strategy at VON ARDENNE, a German vacuum coating equipment…

VON ARDENNE Commissions New Deposition Tool OPTA X300 in Cleanroom

VON ARDENNE is commissioning its new deposition tool, the OPTA X300, in its recently opened cleanroom in Germany. The OPTA X300 enables the production…

Ga₂O₃: A Promising Ultra-Wide Bandgap Material for Next-Generation Power Electronics

Gallium oxide (Ga₂O₃) — especially in its most stable β phase — is attracting strong interest as an ultra-wide bandgap (UWBG) semiconductor with the…

Transitioning Advanced Packaging from More Moore to More than Moore

For decades, the semiconductor industry has pursued a clear objective: to integrate as many functions as possible into a single system-on-chip (SoC).…

VON ARDENNE Unveils New Cleanroom at Headquarters

State-of-the-art facility for sampling, assembly and commissioning

New OPTA X300 Deposition Tool & New Cleanroom

Company showcases its advanced engineering capabilities and new deposition solutions at SEMICON West

CONTACT
No news available.
Sven Frauenstein

Vice President Semiconductor

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