Printed Circuit Boards
Coating Equipment for Seed Layers in Semi-additive Production

New generations of printed circuit boards have structures of only a few micrometers. This development follows the same trend in the semiconductor industry.

As a manufacturer of printed circuit boards, you need additional technologies to create these structures. For the semi-additive (SAP - PCB) production of printed circuit boards with a structure width of less than 30 micrometers, we offer modular vacuum coating systems.

These systems allow you to deposit well adherent nucleated layers of titanium and copper for subsequent electroplating. They are also suitable for panels, flexible printed circuit boards and flexible electrodes.

Would you like to learn more? Then click on the content below or contact us directly.

Highly productive system platform

based on extensive process know-how

Easy adaptation to new processes & requirements

due to flexibly configurable equipment

Cost-efficient equipment

due to fully automated concept

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05.11.2023 - 11.11.2023
AVS Symposium & Exh. Portland 2023

Portland, Oregon Convention Center

14.11.2023 - 17.11.2023
SEMICON Europa 2023

Booth: B2 / 461
München, Messe

29.11.2023 - 01.12.2023
Vacuum Show Japan 2023

Booth: West Hall / 581
Tokyo, Big Sight

Dr. Frank Hinze

Industry ManagerVON ARDENNE GmbH