Printed Circuit Boards
Coating Equipment for Seed Layers in Semi-additive Production

New generations of printed circuit boards have structures of only a few micrometers. This development follows the same trend in the semiconductor industry.

As a manufacturer of printed circuit boards, you need additional technologies to create these structures. For the semi-additive (SAP - PCB) production of printed circuit boards with a structure width of less than 30 micrometers, we offer modular vacuum coating systems.

These systems allow you to deposit well adherent nucleated layers of titanium and copper for subsequent electroplating. They are also suitable for panels, flexible printed circuit boards and flexible electrodes.

Would you like to learn more? Then click on the individual products below or contact us directly.

Highly productive system platform

based on extensive process know-how

Easy adaptation to new processes & requirements

due to flexibly configurable equipment

Cost-efficient equipment

due to fully automated concept

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22.09.2024 - 27.09.2024
European Microwave Week Paris 2024

Booth: 940B
Paris Convention Centre, 1 place de la Porte de Versailles 75015 Paris

12.11.2024 - 15.11.2024

Booth: Stand  C2-453
Messe München

Dr. Frank Hinze

Industry ManagerVON ARDENNE GmbH