Printed Circuit Boards
Coating Equipment for Seed Layers in Semi-additive Production

New generations of printed circuit boards have structures of only a few micrometers. This development follows the same trend in the semiconductor industry.

As a manufacturer of printed circuit boards, you need additional technologies to create these structures. For the semi-additive (SAP - PCB) production of printed circuit boards with a structure width of less than 30 micrometers, we offer modular vacuum coating systems.

These systems allow you to deposit well adherent nucleated layers of titanium and copper for subsequent electroplating. They are also suitable for panels, flexible printed circuit boards and flexible electrodes.

Would you like to learn more? Then click on the individual products below or contact us directly.

Highly productive system platform

based on extensive process know-how

Easy adaptation to new processes & requirements

due to flexibly configurable equipment

Cost-efficient equipment

due to fully automated concept

Equipment
Perspective view of a horizontal VON ARDENNE coating system.
HISSHorizontal Coating SystemLearn more
Perspective view of a vertical VON ARDENNE coating system.
VISSVertical Coating SystemLearn more
Technologies
Magnetron SputteringKey Technology from In-house Development & ManufacturingLearn more
Support

Engineering
Simulation . Sampling . Layout

Learn more
Perspective view of a VON ARDENNE sampling and testing equipment.

Technology & Application Center
Sampling . Development . Scaling

Learn more

Service
Customer Portal . Spare Parts . Trainings

Learn more
Media
Customer Portal "myVA" Now Available

It's here: the myVA Customer Portal. VON ARDENNE has developed it with the aim of simplifying interactions, providing valuable insights and increasing…

CONTACT
12.11.2024 - 15.11.2024
SEMICON 2024

Booth: Stand  C2-453
Messe München

SALES Contact

Am Hahnweg 8
01328 Dresden
Germany

Search