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HISS - Highly Flexible & Scalable Inline Systems

Highly Flexible & Scalable Inline Systems with a modular design For horizontal substrate transport

VISS - Highly flexible & scalable inline systems

Highly flexible & scalable inline systems smooth transition from R&D to production For vertical processes & medium productivity

MEMS - Highly configurable systems for next-generation MEMS manufacturing

Highly configurable systems for next-generation MEMS manufacturing for metallic, non-metallic, optical & semiconducting layers engineering highly customized multi-process support

Cluster Systems - Highly flexible & scalable cluster systems

Highly flexible & scalable cluster systems with modular design For research, development & production

Advanced Packaging - Metallization for the next generation<br>of advanced packaging

Metallization for the next generationof advanced packaging for high-aspect-ratio structures with excellent material adhesion & uniformity

Semiconductors - Engineering tomorrow’s semiconductor deposition solutions

Engineering tomorrow’s semiconductor deposition solutions with an experienced partner through advanced materials innovation & process development

PiezoMEMS - Overcoming film challenges<br>for sensors & actuators

Overcoming film challengesfor sensors & actuators using flexible, high-productivity equipment with high-precision deposition of finely tuned piezo layers

PiezoMEMS - Superior material properties

Superior material properties through highly engineered deposition processes

Cluster Systems - CS300

CS300 Ideal for applications in the semiconductor, optics, and PV industries Optimized for R&D and production of TOPCon and perovskite tandem solar cells

Cluster Systems - CS200

CS200 Ideal for applications in the semiconductor and optics industries High throughput Compact dimensions